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IEE Proc.-Optoelectron., v. 150 (2003) , No. 4, pp. 356 - 359. "Flip-chip bonded InAsSbP and InGaAs LEDs and detectors for the 3 m m spectral region" B.A. Matveev, M. Aydaraliev, N.V. Zotova, S.A. Karandashov, N.D. Il’inskaya, M.A. Remennyi, N.M. Stus' and G.N. Talalakin Light emitting diodes operating in the 2.8¸ 2.9 m m spectral region have been fabricated from InGaAs and InAsSbP p-n structures grown onto n- and heavily doped n+-InAs substrates. Due to high transparency of n+-InAs and n-InGaAs buffer the episide down construction was implemented for LED and photodiode operation with output power and detectivity as high as 400 m W (I=1A) and 1.5´ 1010 cm Hz1/2 W-1 correspondingly. Operation of the LEDs and optically coupled LED-photodiode pairs was demonstrated in the 15¸ 190oC temperature range. |
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